Bonding Tips

Bonding Tips fit into the handheld Bonding Iron and Circuit Bonding System. The bottom surface of each Bonding Tip is used to apply heat and pressure to bond adhesive-backed replacement lands, pads, and edge contacts to a circuit board surface. All Bonding Tips are machined from high-grade aluminum. Bonding Tips do not have a plated finish and may be machined as needed.

115-3210 Bonding Iron, 120 VAC
115-3210 Bonding Iron, 220 VAC
201-5231 Circuit Bonding System

Bonding Tips
Part No.	Description	Price	Qty / Order
115-2801	Bonding Tip, Tapered Tip used to bond replacement conductors to circuit boards.	$48.00 Each
115-2802	Bonding Tip, .080" (2.03 mm) Diameter Tip used to bond replacement conductors to circuit boards.	$48.00 Each
115-2803	Bonding Tip, .120" (3.05 mm) Diameter Tip used to bond replacement conductors to circuit boards.	$48.00 Each
115-2804	Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm) Tip used to bond replacement conductors to circuit boards.	$48.00 Each
115-2805	Bonding Tip, .080" x .120" (2.03 x 3.05 mm) Tip used to bond replacement conductors to circuit boards.	$48.00 Each
Order direct or from a distributor.

Bonding Pressure
Bonding pressure is the recommended force in pounds to apply to the top surface of the replacement pad, land, or conductor based on the Bonding Tip surface area. The recommended Bonding Pressure for Circuit Frames is 200 - 400 psi.

Bonding Pressure
Bonding Tip Part No.	Pressure
115-2801 Bonding Tip, Tapered	N/A
115-2802 Bonding Tip, .080" (2.03 mm) Diameter	1.00 lbs (0.45 kg)
115-2803 Bonding Tip, .120" (3.05 mm) Diameter	2.26 lbs (1.02 kg)
115-2804 Bonding Tip, .040" x .060" (1.02 mm x 1.52 mm)	0.48 lbs (0.218 kg)
115-2805 Bonding Tip, .080" x .120" (2.03 x 3.05 mm)	1.92 lbs (0.87 kg)