115-2706 Bonding Film

$17.00 Each

This sheet of Bonding Film is 1.50" x 2.25" (3.8 x 5.7 cm) in size. It is the same dry adhesive film we apply to circuit frames. Works great when you need to repair lifted pads and conductors without the need to use messy liquid adhesives.

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Specifications [+] Show

Overall Size	2.25" x 1.50" (57 x 38 mm)
Adhesive	Phenolic film adhesive .002" (.051 mm) thick.
Bonding Temperature	475°F +/- 25°F (246°C +/- 14°C)
Bonding Time	30 seconds
Peel Strength	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life	1 year minimum.
REACH	CircuitMedic Bonding Film contains less than 0.1% by weight for any substance listed as a very high concern in REACH.
Outgassing	CircuitMedic Bonding Film consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%

Ordering
115-2706	115-2706 Bonding Film

Classifications ▼

Harmonize Code	3909.40.0000
Export Administration Regulations (EAR)	EAR99
Export Control Classification Number (ECCN)	Not Applicable