115-2706 Bonding Film

$17.00 Each

This sheet of Bonding Film is 1.50" x 2.25" (3.8 x 5.7 cm) in size. It is the same dry adhesive film we apply to circuit frames. Works great when you need to repair lifted pads and conductors without the need to use messy liquid adhesives.

More Information

Specifications [+] Show

Overall Size	2.25" x 1.50" (57 x 38 mm)
Adhesive	Phenolic film adhesive .002" (.051 mm) thick.
Bonding Temperature	475°F +/- 25°F (246°C +/- 14°C)
Bonding Time	30 seconds
Peel Strength	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life	1 year minimum.
REACH	CircuitMedic Bonding Film contains less than 0.1% by weight for any substance listed as a very high concern in REACH.
Outgassing	CircuitMedic Bonding Film consistently meets the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%

DATA SHEET

Ordering
115-2706	115-2706 Bonding Film

Classifications ▼

Harmonize Code	3909.40.0000
Export Administration Regulations (EAR)	EAR99
Export Control Classification Number (ECCN)	Not Applicable