The Land/Pad Repair Kit provides the tools and materials required to reliably repair or replace damaged lands, surface-mount pads and BGA pads on printed circuit boards. The kit is designed to restore PCB functionality using IPC-recommended repair techniques commonly used in professional electronics manufacturing and repair environments.

Replacement lands and pads are supplied on Circuit Frames made from rolled copper with a dry-film adhesive backing. Technicians simply select the appropriate pattern, trim it from the frame and bond it to the circuit board using controlled heat and pressure. The adhesive cures quickly, forming a strong, reliable bond that restores the original conductor geometry and solderability.

The kit includes a temperature-controlled bonding iron and bonding tips designed to activate the adhesive film and ensure consistent bonding results. A multifunction epoxy is also included for over-coating the repair area and restoring solder mask and base board repair.

All tools and materials are organized in a rugged ESD-safe carrying case, making the kit easy to transport and ideal for production, laboratory and field repair environments.