The Circuit Bonding System is a precision machine designed to bond replacement pads, lands and conductors to printed circuit boards using controlled heat and pressure. The system is widely used to repair damaged surface mount pads, BGA pads and circuit traces while maintaining consistent bonding quality and process repeatability.

The bonding process uses adhesive-backed Circuit Frames that are positioned over the repair site and permanently bonded to the PCB surface. A heated bonding tip applies uniform temperature while a digital force gauge regulates the compression force, ensuring the proper bonding pressure throughout the cure cycle.

The system includes a Flex-Rack PCB Holder to keep the board flat and stable during the bonding operation, helping technicians maintain accurate alignment of replacement pads and conductors. The adjustable heater maintains a consistent temperature during the typical 30-second bonding cycle, producing reliable adhesion and repeatable repair results.

Built with heavy-duty aluminum and stainless steel components and a wide base for stability, the Circuit Bonding System provides the precision, control and durability required for professional PCB repair environments.

Shown with Optional Extension Block Kit