115-2801 Bonding Tip, Tapered

$48.00 Each

Bonding Tips fit into the Bonding Iron. The bottom machined surface of each Bonding Tip is used to apply heat and pressure to bond adhesive-backed replacement lands, pads, and edge contacts to a circuit board surface. All Bonding Tips are machined from high-grade aluminum.

Used with the Bonding Iron and Circuit Bonding System.
115-3210 Bonding Iron
115-3220 Bonding Iron
201-5231 Circuit Bonding System

Bonding Tips Sold individually.

Ordering
115-2801	115-2801 Bonding Tip, Tapered

Classifications ▼

Harmonize Code	8207.19.5030
Export Administration Regulations (EAR)	EAR99
Export Control Classification Number (ECCN)	Not Applicable