115-3220 Bonding Iron, 230 VAC
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| $76.00 Each |
DATA SHEET
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Temperature-controlled bonding iron designed to cure dry film adhesive used in circuit board repair. Delivers precise heat for bonding replacement pads, lands and edge contacts, with adjustable temperature from 180–480 °C for reliable PCB rework.
The Bonding Iron has adjustable temperature control that you can set at the optimal temperature for curing the bonding film used to repair damaged surface mount pads, lands, edge contacts, and other circuit board patterns. You can adjust the temperature between 180 and 480 °C (350 to 900 °F) and switch between °C and °F. The temperature remains stable =/- 5°.
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